Solder paste is definitely an vital portion of SMT manufacturing course of action. The size of steel powder in solder paste, the distribution of metallic content material, the proportion of flux, rewarming time, stirring time, storage environment and storage time of solder paste will have an effect on the printing good quality of solder paste.
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The composition of SMT solder paste might be divided into two parts: flux and solder powder.
(1) The main parts and features of flux are as follows
Thixotropic agent: this component is principally utilized to regulate the viscosity and printing functionality of solder paste to forestall the appearance of tailing and adhesion in printing;
Activator: this component can take away the oxide on the surface of PCB copper film pad plus the welding areas of elements, and decrease the floor pressure of tin and direct;
Solvent: the element is the solvent of flux part, which plays a fair position inside the mixing process of solder paste, and has a certain affect to the assistance existence of solder paste;
Resin: it can boost the adhesion of solder paste, defend and stop PCB from reoxidation immediately after soldering. It performs an essential function in repairing sections;
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(two) Solder powder:
Alloy solder powder could be the main ingredient of solder paste, accounting for 85-90% of the solder paste good quality. The frequently utilized alloy welding powders are as follows: Sn Pb, Sn Pb AG, Sn Pb Bi, Sn Bi, Sn Bi Ag and Sn Ag Cu. The composition and ratio of solder powder, its form, particle sizing and surface area oxidation diploma have excellent impact on the houses of solder paste.
When the metal written content is higher, the slump of solder paste may be improved, which is conducive on the formation of entire solder joints. Thanks for the somewhat compact amount of flux, it could reduce the flux residue and efficiently prevent the appearance of solder beads. Its downside is always that the printing and welding approach specifications are rigorous. If the metal content is lower, the printability is nice, the solder paste will not be uncomplicated to stay for the scraper, the assistance everyday living of the bushing is very long, the wettability is nice, along with the processing is a snap; the drawback is that it is easy to break down, as well as flaws these types of as solder beads and bridging are easy to appear. Thus, it truly is vital to pick appropriate tin powder technical specs.
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The shape of alloy solder powder may be divided into spherical condition and oval shape. The spherical solder has great properties. The particle sizing of solder powder is 200 / 325, which calls for finer steel particle dimension for fantastic spacing printing. Normally, the scale and shape of tin powder particles are based on the opening dimensions of printing steel mesh or steel mesh or the diameter of syringe. Tin powder with various particle measurement need to be chosen for different pad dimensions and component pins, and smaller particles really should not be picked since little particles have considerably greater surface area place, that is easy to worsen the stress of solder through floor oxidation cure.
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